The main application of tungsten copper alloy

Tungsten copper alloy combines the advantages of tungsten and copper, of which the tungsten has high melting point (tungsten melting point is 3410 degrees Celsius, copper melting point is 1080 degrees Celsius), and high density (tungsten density is 19.34g/cm3, the density of copper is 8.89 g/cm3), the copper has superior electric and thermal conductivity. Tungsten copper alloy (component range WCu7~WCu50) has homogeneous microstructure, high temperature resistance, high strength, good resistance to arc erosion, high density, moderate thermal conductivity, high temperature resistant materials, which is widely used in military, high-voltage switch with electrical alloy, EDM electrode, microelectronic material, and widely used in aviation, electronics, electric power, metallurgy, machinery, sports equipment and other industries as aerospace parts and components.
 
Tungsten copper alloy used in aerospace as a missile, rocket engine nozzle, gas rudder, air rudder, nose cone, the main requirement is to require high temperature (3000K~5000K), high temperature erosion resistance. It mainly uses the role of transpiration cooling (copper melting point 1083 degrees C) of copper, formed in the high temperature evaporation, to reduce the surface temperature of tungsten copper, and ensure the use of extreme temperature conditions.
 
Tungsten copper alloy is widely used in high voltage switch 128kV SF6, circuit breaker WCu/CuCr, and the high-voltage vacuum load switch (12kV 40.5KV 1000A). The high voltage vacuum switch arrester has small volume, easy maintenance, wide application range, which can use in the wet, flammable and explosive and corrosive environment. The main performance requirements are arc erosion resistance, resistance to fusion welding, small cut-off current, low gas content, low thermal electron emission ability. In addition to the conventional macro performance requirements, it also requires porosity, microstructure and performance, it is necessary to take special processes, vacuum degassing, vacuum infiltration and other complex processes.




 
 
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